The magnetron sputtering method allows applying thin-film coatings of almost any material to substrates: metals, semiconductors, and even dielectrics. The use of this method for the synthesis of multilayer X-ray mirrors has become widespread in the world. Mirrors synthesized with the development and improvement of technology have made it possible to achieve significant success in various fields of science and technology, such as solar physics, the study of high-temperature laboratory plasma, projection X-ray lithography, X-ray microscopy, etc.
In our laboratory, this technology is implemented on 7 units. Some of them are equipped with two magnetron sources, some - with four, and some - with six. The sizes of the sputtered targets and vacuum chambers allow applying thin-film coatings to substrates with diameters of up to 350 mm. The uniformity of film thickness over the area, even for substrates with curvature, is tenths of a percent. Samples are loaded on some units through a lock chamber, which significantly saves labor costs and improves the quality of the sputtered structures.
Technical specifications
Number of magnetrons, pcs. |
2, 4, 6 |
Maximum substrate size in diameter, mm |
350 |
Surface shape of substrates |
Flat, concave or convex. If there is curvature, axial symmetry is desirable |
Sprayable materials |
Metals, non-metals – semiconductors, dielectrics. Spraying of magnetic materials is possible |
Film growth rate, nm/sec |
~ 0.1-1.0 |
Uniformity of coating thickness over the substrate area, % |
< 1 |
Reactive magnetron sputtering |
Ar + O2, N2, Kr, Ne, He, Xe |
RF spray capability |
Yes |
Type of substrate holder movement |
Circular, linear |